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Linear Technology and Microbonds Announc
Linear Technology and Microbonds Announce Qualification of X-Wire? Technology MILPITAS, Calif. & TORONTO--(BUSINESS WIRE
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Mentor Graphics Donates Unified Coverage Database (UCDB) to the Accellera Unified Coverage Interoper
Cree LR6 LED Light Wins Silver International Design Excellence Award (IDEA)
Next Inning Technology Updates Outlooks for National Semiconductor, International Rectifier, Zoran,
Jedec group will set flash drive standards
Zacks Equity Research Analyst Blog
Brussels Throws Another Punch at Intel
Philips reports strong sales of EUR 6.5 billion, up 6% year-on-year; EBITA rises to EUR 413 million
Hauppauge Selects NXP PC TV System-on-Chip for Award-Winning Dual Hybrid PC TV Tuner
ARM Mali-200 GPU World’s First To Achieve Khronos OpenGL ES 2.0 Conformance At 1080p HDTV Resolution
NAND Market Faces Oversupply, Weak Demand
TSV Apps Need TSV Tools
Fabless semi revenue up 16% y/y in Q1, GSA reports
Design for Manufacturability — Break on Through
Allegro MicroSystems, Inc. Introduces a New Four-Channel High-Side MOSFET Control/Driver IC
Advanced Nodes — Viability Meets Manufacturability
Lithography for the 22 nm Node
Broadcom co-founder Nicholas indicted on drug, fraud, conspiracy charges
First SiC Switching Power Bipolar Junction Transistor Announced
Data Converters Feature High Signal-To-Noise Ratios
Chip Market Researchers Turn Bullish
Latest Products
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TMD Launches Modular Test Station For Travelling Wave Tubes
IR’s SupIRBuck Family of Integrated DC-DC Regulators Shrinks Silicon Footprint by 70 Percent
IR’s IR3514 and IR3507 XPhase? Chipset Provides Full-featured, Flexible Approach to Implementing Com
IR’s Real-time Power Monitoring IC Accurately Captures Highly Dynamic Power Information and Maximize
Finder range of light dependent relays
Sharp 108in full high-definition LCD display
Gleichmann Sunrise GE-Oxxxx series of chip-on-glass LCD modules
Fujikura One-Click-Cleaner for backplane connector cleaning
Enterprise News
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AMD beats expectations, but posts 8th straight loss
NXP Technology seeks to reduce carbon emissions
Vishay cuts 3Q revenue guidance
Philips shows magic wands and electric dresses
Silicon ink targets RFIDs
NEC Electronics Demonstrates Moorestown Power Management IC Solution at Intel Developer Forum Taiwan
Microchip Pioneer Jack Kilby Kept Clicking Off Ideas
Intel Seeking to Host FPGAs for Low Latency
IC design house Sonix to report record sales in July
IC distributor Yosun expects to hit sales record in July on increased memory shipments
Latest News
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WSTS statistics chart updated
Nokia Q3 below consensus, outlook soothes market
Advanced Micro Devices: Can Gamers Bring This Chip Maker Back to Life?
NetLogic Microsystems Reports Inducement Grants Under NASDAQ Marketplace Rule 4350
Spansion CEO Bertrand Cambou to Keynote at 2008 Flash Memory Summit in Santa Clara
Actual data shows global chip market grew 12.2% in June
Philips announces completion of sale of MedQuist stake to CBaySystems
Intel-AMD trial delayed to 2010 in US court
ASE expects weak growth for 3Q08; plans capex cut
PSC chairman vows to stay on despite insider trading indictment
Industry News
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EDN HOT 100 PRODUCTS 2009
Nokia set to pay Qualcomm $2.3bn in patent deal
DRAM Suppliers Show Poor Q2 Results; Elpida Attempts to Catch Hynix, Says iSuppli
VIA Reportedly Exiting Its Motherboard Chipset Business
Emerging markets become factor in ICs
Short-term DRAM weakness in prospect - iSuppli
Atmel Sales Balanced by Costs
Rohm and Haas expands Asia-Pacific manufacturing plant
Market for SOI to reach $1.1B by 2012, VLSI Research reports
Agilent, picoChip, mimoOn look to 3GPP LTE femtocell opportunities
Technical Innovation
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WaveZero Form/Met shields offers green alternative to EMC shields
UMC, Sematech partner to propel 300-mm technology
Labour Law of the People’s Republic of China
Measures for Administration of Import of Specified Used Mechanical and Electronic Products
Regulation on Risk Management of Securities Firms
Measures for Strategic Investment by Foreign Investors upon Listed Companies
Announcement No.12, 2008 of Ministry of Commerce, Promulgating Catalogue of Prevailing Valid and Eff
THE SUPPLEMENTARY AGREEMENT ON TRADE IN SERVICES
Announcement No.29, 2008 of the Ministry of Commerce of the People’s Republic of China
Announcement No.23, 2008 of Ministry of Commerce
Market Analysis
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DDR3 demand expected to strain supply channel, Converge reports
India’s design strengths and competitive advantages
Americas chip market contracting at 15% year-on-year, says WSTS
Semiconductor Rankings: Roadmap to Investment Opportunities?
Outsourcing services now a key part of manufacturing chain, Gartner reports
Bad economy good for PC market
IC Insights warns of disconnect between capital spending cuts, volume shipment increases
The Application of LEDs for Industrial LCD Modules
Intel CEO: Smaller gadgets will expand market
Asus Eee vs MSI Wind: The Battle of the Petite
Exhibition News
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The 104th session of China Import and Export Fair
2008 International Electronic Equipments and Electronic components(China) Fair
